JPH0222258U - - Google Patents
Info
- Publication number
- JPH0222258U JPH0222258U JP9922188U JP9922188U JPH0222258U JP H0222258 U JPH0222258 U JP H0222258U JP 9922188 U JP9922188 U JP 9922188U JP 9922188 U JP9922188 U JP 9922188U JP H0222258 U JPH0222258 U JP H0222258U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- opening part
- opening
- mask plate
- resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9922188U JPH0222258U (en]) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9922188U JPH0222258U (en]) | 1988-07-27 | 1988-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0222258U true JPH0222258U (en]) | 1990-02-14 |
Family
ID=31326178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9922188U Pending JPH0222258U (en]) | 1988-07-27 | 1988-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222258U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5475072A (en) * | 1977-11-29 | 1979-06-15 | Fujitsu Ltd | Method of soldering circuit substrate |
-
1988
- 1988-07-27 JP JP9922188U patent/JPH0222258U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5475072A (en) * | 1977-11-29 | 1979-06-15 | Fujitsu Ltd | Method of soldering circuit substrate |